Publications

The following list of publications is based on publications from Professor Rajan Ambat and Professor Jesper Hattel's researchers in the INSPE project. The list is automatically generated by the university database, and hence, it can also contains publications that are not related to the IN SPE project.

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ALL ARTICLE (54) DISSERTATION (5) BOOK (1) CONF (35) REPORT (0) MISC (0) PATENT (0) PEER REV (90)
2024
 

Study of interaction between Reflow solder flux and humidity in relation to failures in electronics

Lakkaraju, Anish Rao ; Conseil-Gudla, Helene ; Ambat, Rajan
in: IEEE Transactions on Components, Packaging and Manufacturing Technology

Type: Journal article (Peer reviewed)

Status: Accepted/In press     |    Year: 2024     |    DOI: https://doi.org/10.1109/TCPMT.2024.3369076

2022
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A climate classification for corrosion control in electronic system design

Spooner, Max ; Ambat, Rajan ; Gudla, Helene Conseil ; Kulahci, Murat
in: Machine Learning with Applications, vol: 9

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2022     |    DOI: https://doi.org/10.1016/j.mlwa.2022.100397

 

Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study

Xue, Peng ; Bahman, Amir Sajjad ; Iannuzzo, Francesco ; Gudla, Helene Conseil ; Lakkaraju, Anish Rao ; Ambat, Rajan
in: Microelectronics Reliability, vol: 139

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2022     |    DOI: https://doi.org/10.1016/j.microrel.2022.114796

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Synergetic effect of temperature and humidity on the leakage of KOH electrolyte and related reliability of zinc-air batteries

Rao, Jyothsna Murli ; Yadav, Abhijeet ; Conseil-Gudla, Helene ; Ambat, Rajan
in: Frontiers in Materials, vol: 9

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2022     |    DOI: https://doi.org/10.3389/fmats.2022.1000808

 

Transient risk of water layer formation on PCBAs in different climates: Climate data analysis and experimental study

Conseil-Gudla, Helene ; Spooner, Max ; Kulahci, Murat ; Ambat, Rajan
in: Microelectronics Reliability, vol: 136

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2022     |    DOI: https://doi.org/10.1016/j.microrel.2022.114655

2021
 

Alkanolamines as activators in no-clean flux systems: investigation of humidity robustness and solderability

Li, Feng ; Piotrowska, Kamila ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Materials Science: Materials in Electronics, vol: 32, pages: 4961–4981

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2021     |    DOI: https://doi.org/10.1007/s10854-020-05235-0

 

Humidity Control in Electronic Devices

Conseil-Gudla, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol: 11, issue: 2, pages: 324-332

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2021     |    DOI: https://doi.org/10.1109/TCPMT.2020.3045495

 

Investigation on the Hygroscopicity of Deposits at the Cold-End of Biomass and Coal-Fired Plants

Pan, Peiyuan ; Piotrowska, Kamila ; Montgomery, Melanie ; Ambat, Rajan ; Jellesen, Morten Stendahl ; Chen, Heng
in: Energy and Fuels, vol: 35, issue: 9, pages: 8006–8022

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2021     |    DOI: https://doi.org/10.1021/acs.energyfuels.0c04221

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Reflow Residues on Printed Circuit Board Assemblies and Interaction with Humidity

Conseil-Gudla, Helene ; Li, Feng ; Ambat, Rajan
in: IEEE Transactions on Device and Materials Reliability, vol: 21, issue: 4, pages: 594-602

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2021     |    DOI: https://doi.org/10.1109/TDMR.2021.3120941

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The detrimental effects of water on electronic devices

Baylakoğlu, İlknur ; Fortier, Aleksandra ; Kyeong, San ; Ambat, Rajan ; Gudla, Helene Conseil ; H. Azarian, Michael ; G. Pecht, Michael
in: e-Prime - Advances in Electrical Engineering, Electronics and Energy, vol: 1, issue: 1

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2021     |    DOI: https://doi.org/10.1016/j.prime.2021.100016

2020
 

Humidity Robustness of Plasma-Coated PCBs

Khangholi, Aliakbar ; Li, Feng ; Piotrowska, Kamila ; Loulidi, Samir ; Ambat, Rajan ; Van Assche, Guy ; Hubin, Annick ; De Graeve, Iris
in: Journal of Electronic Materials, vol: 49, issue: 1, pages: 848-860

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2020     |    DOI: https://doi.org/10.1007/s11664-019-07714-5

 

Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys

Li, Feng ; Verdingovas, Vadimas ; Dirscherl, Kai ; Harsányi, Gábor ; Medgyes, Bálint ; Ambat, Rajan
in: Journal of Materials Science: Materials in Electronics, vol: 31, pages: 15308–15321

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2020     |    DOI: https://doi.org/10.1007/s10854-020-04095-y

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Parametric study of regional climates on electronics: Understanding local climate effects on corrosion failure mechanisms

Guo, Qinim ; Conseil-Gudla, Helene ; Ambat, Rajan
Presented at: EUROCORR 2020

Type: Conference abstract for conference (Peer reviewed)

Status: Published     |    Year: 2020

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Residue-Assisted Water Layer Build-Up under Transient Climatic Conditions and Failure Occurrences in Electronics

Piotrowska, Kamila ; Ambat, Rajan
in: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol: 10, issue: 10, pages: 1617-1635

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2020     |    DOI: https://doi.org/10.1109/TCPMT.2020.3005933

 

Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability

Piotrowska, Kamila ; Li, Feng ; Ambat, Rajan
in: Soldering & Surface Mount Technology, vol: 32, issue: 2, pages: 93-103

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2020     |    DOI: https://doi.org/10.1108/ssmt-05-2019-0020

2019
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Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations

Joshy, Salil ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Microelectronics Reliability, vol: 93, pages: 81-88

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1016/j.microrel.2018.12.010

 

Electrochemical Impedance Spectroscopy (EIS) for Monitoring the Water Load on PCBAs Under Cycling Condensing Conditions to Predict Electrochemical Migration Under DC Loads

Lauser, Simone ; Richter, Theresia ; Verdingovas, Verdimas ; Ambat, Rajan
part of: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), pages: 515-521, 2019
Presented at: 69th Electronic Components and Technology Conference

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1109/ECTC.2019.00084

 

Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions

Piotrowska, Kamila ; Lagana, Simone ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2019, 2019
Presented at: 2019 Pan Pacific Microelectronics Symposium

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.23919/PanPacific.2019.8696890

 

Long term prediction of local climate inside an electronics enclosure

Shojaee Nasirabadi, Parizad ; Ghiaasiaan, S. Mostafa ; Hattel, Jesper Henri
in: International Journal of Heat and Mass Transfer, vol: 137, pages: 280-291

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2019.03.128

 

No-Clean Solder Flux Chemistry and Temperature Effects on Humidity-Related Reliability of Electronics

Piotrowska, Kamila ; Grzelak, Magdalena ; Ambat, Rajan
in: Journal of Electronic Materials, vol: 48, issue: 2, pages: 1207-1222

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1007/s11664-018-06862-4

2018
 

A 3D numerical study of humidity evolution and condensation risk on a printed circuit board (PCB) exposed to harsh ambient conditions

Shojaee Nasirabadi, Parizad ; Hattel, Jesper Henri
in: Microelectronics Reliability, vol: 83, pages: 39-49

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1016/j.microrel.2018.02.008

 

Corrosion Reliability of Lead-Free Solder Systems Used in Electronics

Li, Feng ; Verdingovas, Vadimas ; Dirscherl, Kai ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) , pages: 67-71, 2019
Presented at: 2018 IMAPS Nordic Conference on Microelectronics Packaging

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.23919/NORDPAC.2018.8423855

 

Effect of Solder Mask Surface Chemistry and Morphology on the Water Layer Formation Under Humid Conditions

Piotrowska, Kamila ; Din, Rameez Ud ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: I E E E Transactions on Components, Packaging and Manufacturing Technology, vol: 8, issue: 10, pages: 1756-1768

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1109/TCPMT.2018.2792047

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Experimental Study of Moisture Ingress in First and Second Levels of Electronic Housings

Conseil-Gudla, Helene ; Hamm, Gerald ; Mueller, Lutz ; Hain, Mathias ; Ambat, Rajan
in: I E E E Transactions on Components, Packaging and Manufacturing Technology, vol: 8, issue: 11, pages: 1928-1937

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1109/TCPMT.2018.2799233

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Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction

Conseil-Gudla, H. ; Staliulionis, Z. ; Mohanty, S. ; Jellesen, M. S. ; Hattel, J. H. ; Ambat, R.
in: Microelectronics Reliability, vol: 82, pages: 136-146

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1016/j.microrel.2018.01.013

 

Humidity-related failures in electronics: effect of binary mixtures of weak organic acid activators

Piotrowska, Kamila ; Verdingovas, Vadimas ; Ambat, Rajan
in: Journal of Materials Science: Materials in Electronics, vol: 29, issue: 20, pages: 17834-17852

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1007/s10854-018-9896-0

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Implementation of electrochemical impedance spectroscopy (EIS) for assessment of humidity induced failure mechanisms on PCBAs

Lauser, Simone ; Eckold, Pierre ; Richter, Theresia ; Verdingovas, Vadimas ; Ambat, Rajan
Presented at: EUROCOR 2018 - Applied science with contstant awareness

Type: Paper (Peer reviewed)

Status: Published     |    Year: 2018

 

Introduction of axial chirality at a spiro carbon atom in the synthesis of pentaerythritol-imine macrocycles

Grajewski, J. ; Piotrowska, K. ; Zgorzelak, M. ; Janiak, A. ; Biniek-Antosiak, K. ; Rychlewska, U. ; Gawronski, J.
in: Organic & Biomolecular Chemistry, vol: 16, issue: 6, pages: 981-987

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1039/C7OB02672B

 

Modeling of Moisture Transport into an Electronic Enclosure Using the Resistor-Capacitor Approach

Staliulionis, Z. ; Conseil-Gudla, H. ; Mohanty, S. ; Jabbari, M. ; Ambat, R. ; Hattel, J. H.
in: Journal of Electronic Packaging, vol: 140, issue: 3

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1115/1.4039790

 

Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics

Piotrowska, Kamila ; Ud Din, Rameez ; Grumsen, Flemming Bjerg ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Electronic Materials, vol: 47, issue: 7, pages: 4190-4207

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1007/s11664-018-6311-9

 

Water film formation on the PCBA surface and failure occurrence in electronics

Piotrowska, Kamila ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) , pages: 72-76, 2018
Presented at: 2018 IMAPS Nordic Conference on Microelectronics Packaging

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.23919/NORDPAC.2018.8423854

2017
 

Analysis of surface insulation resistance related failures in electronics by circuit simulation

Verdingovas, Vadimas ; Joshy, Salil ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Circuit World, vol: 43, issue: 2, pages: 45-55

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1108/CW-09-2016-0040

 

A numerical investigation of the effect of ambient conditions on natural convection cooling of electronics

Shojaee Nasirabadi, Parizad ; Hattel, Jesper Henri
part of: 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2017), pages: 1-4, 2017
Presented at: 23rd International Workshop on Thermal Investigations of ICs and Systems

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/THERMINIC.2017.8233845

 

CFD simulation and statistical analysis of moisture transfer into an electronic enclosure

Shojaee Nasirabadi, Parizad ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
in: Applied Mathematical Modelling, vol: 44, pages: 246–260

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1016/j.apm.2016.09.004

 

Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Microelectronics Reliability, vol: 73, pages: 158-166

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1016/j.microrel.2017.05.005

 

Corrosion in Electronics

Ambat, Rajan ; Gudla, Helene Virginie Conseil ; Verdingovas, Vadimas
part of: Reference Module in Chemistry, Molecular Sciences and Chemical Engineering, 2017

Type: Encyclopedia chapter (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1016/B978-0-12-409547-2.13437-7

 

Corrosion reliability of lead-free solder systems used in electronics

Li, Feng ; Verdingovas, Vadimas ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017 , 2017
Presented at: 40th International Spring Seminar on Electronics Technology

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/ISSE.2017.8000929

 

Corrosion Reliability of Lead-free Solder Systems Used in Electronics

Li, Feng ; Verdingovas, Vadimas ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress (EUROCORR 2017), 2017
Presented at: European Corrosion Congress (EUROCORR 2017)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017

 

Drying of a tape-cast layer: Numerical investigation of influencing parameters

Jabbaribehnam, Mirmasoud ; Shojaee Nasirabadi, Parizad ; Jambhekar, V. A. ; Hattel, Jesper Henri ; Helmig, R.
in: International Journal of Heat and Mass Transfer, vol: 108, pages: 2229-2238

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2017.01.074

 

Effect of interior geometry on local climate inside an electronic device enclosure

Joshy, Salil ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the 16th IEEE Intersociety Conference onThermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2017) , pages: 779-783, 2017
Presented at: 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/ITHERM.2017.7992565

 

Electrochemical migration of lead-free solder alloys in Na2SO4 environment

Medgyes, Balint ; Ádám, Sándor ; Tar, Lajos ; Verdingovas, Vadimas ; Ambat, Rajan ; Harsányi, Gábor
part of: Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017 , 2017
Presented at: 40th International Spring Seminar on Electronics Technology

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/ISSE.2017.8000932

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Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Conseil, Helene ; Staliulionis, Zygimantas ; Jellesen, Morten Stendahl ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri ; Ambat, Rajan
in: I E E E Transactions on Components, Packaging and Manufacturing Technology, vol: 7, issue: 3, pages: 412 - 423

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/TCPMT.2017.2655447

 

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Conseil, Helene ; Gudla, Visweswara Chakravarthy ; Borgaonkar, Shruti ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Materials Science: Materials in Electronics, vol: 28, issue: 8, pages: 6138-6151

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1007/s10854-016-6292-5

 

Mathematical modelling of moisture transport into an electronic enclosure under non-isothermal conditions

Staliulionis, Ž. ; Mohanty, S. ; Jabbari, Mahmoud ; Hattel, Jesper Henri
in: Microelectronics Reliability, vol: 79, pages: 526-532

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1016/j.microrel.2017.04.027

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On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

D’Angelo, L. ; Verdingovas, V. ; Ferrero, L. ; Bolzacchini, E. ; Ambat, R.
in: IEEE Transactions on Device and Materials Reliability, vol: 17, issue: 4, pages: 746-757

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/TDMR.2017.2771505

 

Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Electronic Materials, vol: 46, issue: 2, pages: 817–825

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1007/s11664-016-4974-7

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Reliability of electronics to humidity-related failures

Joshy, Salil ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Book of Abstracts Sustain 2017, 2017
Presented at: DTU Sustain 2017

Type: Conference abstract in proceedings (Peer reviewed)

Status: Published     |    Year: 2017

 

The influence of solder mask and hygroscopic flux residues on water layer formation on PCBA surface and corrosion reliability of electronics

Piotrowska, Kamila ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress (EUROCORR 2017), 2017
Presented at: European Corrosion Congress (EUROCORR 2017)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017

 

Thermal decomposition of solder flux activators under simulated wave soldering conditions

Piotrowska, Kamila ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Soldering & Surface Mount Technology, vol: 29, issue: 3, pages: 133-143

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1108/SSMT-01-2017-0003

2016
 

Analysis of moisture transport between connected enclosures under a forced thermal gradient

Staliulionis, Zygimantas ; Joshy, Salil ; Ambat, Rajan ; Jabbaribehnam, Mirmasoud ; Mohanty, Sankhya ; Hattel, Jesper Henri
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 320-324, 2017
Presented at: 18th Electronics Packaging Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/EPTC.2016.7861497

 

Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

Conseil, Helene ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Materials Science: Materials in Electronics, pages: 23-32

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1007/s10854-015-3712-x

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Estimation of Water Diffusion Coefficient into Polycarbonate at Different Temperatures Using Numerical Simulation

Shojaee Nasirabadi, Parizad ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
in: A I P Conference Proceedings Series, vol: 1738
Presented at: 13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)

Type: Conference article (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1063/1.4951801

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Experimental study of humidity distribution inside electronic enclosure and effect of internal heating

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress : EUROCORR 2015, 2016
Presented at: The European Corrosion Congress - EUROCORR 2015

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016

 

Humidity Build-Up in a Typical Electronic Enclosure Exposed to Cycling Conditions and Effect on Corrosion Reliability

Conseil, Helene ; Gudla, Visweswara Chakravarthy ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: I E E E Transactions on Components, Packaging and Manufacturing Technology, vol: 6, issue: 9, pages: 1379-1388

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/TCPMT.2016.2590779

 

Improving intrinsic corrosion reliability of printed circuit board assembly

Ambat, Rajan ; Conseil, Helene
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 540-544, 2017
Presented at: 18th Electronics Packaging Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/EPTC.2016.7861538

 

Mathematical modelling of coupled heat and mass transport into an electronic enclosure

Staliulionis, Zygimantas ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
part of: Proceedings of the 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016 , pages: 323-326, 2016
Presented at: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/THERMINIC.2016.7749076

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Moisture ingress into electronics enclosures under isothermal conditions

Staliulionis, Zygimantas ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
in: A I P Conference Proceedings Series, vol: 1738
Presented at: 13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)

Type: Conference article (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1063/1.4951797

 

Numerical simulation of transient moisture and temperature distribution in polycarbonate and aluminum electronic enclosures

Shojaee Nasirabadi, Parizad ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
part of: Proceedings of the 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) , 2016
Presented at: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/EuroSimE.2016.7463382

  PDF

Numerical Simulation of Transient Moisture Transfer into an Electronic Enclosure

Shojaee Nasirabadi, Parizad ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
in: A I P Conference Proceedings Series, vol: 1738
Presented at: 13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)

Type: Conference article (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1063/1.4951794

 

Optimization of electronic enclosure design for thermal and moisture management using calibrated models of progressive complexity

Mohanty, Sankhya ; Staliulionis, Zygimantas ; Shojaee Nasirabadi, Parizad ; Ambat, Rajan ; Hattel, Jesper Henri
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 483-487, 2017
Presented at: 18th Electronics Packaging Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/EPTC.2016.7861525

 

Semi-empirical prediction of moisture build-up in an electronic enclosure using analysis of variance (ANOVA)

Shojaee Nasirabadi, Parizad ; Conseil, Helene ; Mohanty, Sankhya ; Jabbaribehnam, Mirmasoud ; Ambat, Rajan ; Hattel, Jesper Henri
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 785-790, 2017
Presented at: 18th Electronics Packaging Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/EPTC.2016.7861588

2015
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Contamination, potential bias and humidity effects on electrical performance and corrosion reliability of electronic devices

Piotrowska, Kamila ; Verdingovas, Vadimas ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress, 2015
Presented at: The European Corrosion Congress - EUROCORR 2015

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2015

 

Effect of iodine on the corrosion of Au-Al wire bonds

Verdingovas, Vadimas ; Müller, Lutz ; Jellesen, Morten Stendahl ; Grumsen, Flemming Bjerg ; Ambat, Rajan
in: Corrosion Science, vol: 97, pages: 161-171

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/10.1016/j.corsci.2015.05.003

 

Effect of pulsed voltage on electrochemical migration of tin in electronics

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Materials Science: Materials in Electronics, vol: 26, issue: 10, pages: 7997-8007

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/10.1007/s10854-015-3454-9

 

Experimental study of humidity and temperature profile into electronic enclosure exposed to high humidity and thermal cycles

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the IMAPS Nordic Annual Conference 2015, pages: 111-117, 2016
Presented at: IMAPS Nordic Annual Conference 2015

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2015

 

Relative effect of solder flux chemistry on the humidity related failures in electronics

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Soldering & Surface Mount Technology, vol: 27, issue: 4, pages: 146-156

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/dx.doi.org/10.1108/SSMT-11-2014-0022

 

Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

Joshy, Salil ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the 17th Electronics Packaging and Technology Conference (EPTC) , 2016
Presented at: 17th Electronics Packaging and Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/10.1109/EPTC.2015.7412281

 

Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Electronic Materials, vol: 44, issue: 4, pages: 1116-1127

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/10.1007/s11664-014-3609-0

 

Steam assisted oxide growth on aluminium alloys using oxidative chemistries: Part I Microstructural investigation

Din, Rameez Ud ; Piotrowska, Kamila ; Gudla, Visweswara Chakravarthy ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Applied Surface Science, vol: 355, pages: 820-831

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/10.1016/j.apsusc.2015.07.182

2014
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Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of EuroCorr 2014, 2014
Presented at: European Corrosion Congress

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014

 

Contamination profile on typical printed circuit board assemblies vs soldering process

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Soldering & Surface Mount Technology, vol: 26, issue: 4, pages: 194–202

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2014     |    DOI: https://doi.org/10.1108/SSMT-03-2014-0007

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Corrosion in electronics: Overview of failures and countermeasures

Jellesen, Morten Stendahl ; Verdingovas, Vadimas ; Conseil, Helene ; Piotrowska, Kamila ; Ambat, Rajan
part of: Proceedings of EuroCorr 2014, 2014
Presented at: European Corrosion Congress

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014

  PDF

Corrosion reliability of electronics: the influence of solder temperature on the decomposition of flux activators

Piotrowska, Kamila ; Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of EuroCorr 2014, 2014
Presented at: European Corrosion Congress

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014

 

Electrochemical migration in electronics: effect of contamination and bias conditions

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
Presented at: European Corrosion Congress

Type: Conference abstract for conference (Peer reviewed)

Status: Published     |    Year: 2014

 

Experimental study of water absorption of electronic components and internal local temperature and humidity into electronic enclosure

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the 16th Electronics Packaging Technology Conference (EPTC 2014) , pages: 355-359, 2015
Presented at: 16th Electronics Packaging Technology Conference

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014     |    DOI: https://doi.org/10.1109/EPTC.2014.7028356

 

Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: I E E E Transactions on Device and Materials Reliability, vol: 14, issue: 1, pages: 42-51

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2014     |    DOI: https://doi.org/10.1109/TDMR.2013.2293792

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Perspectives on the climatic reliability issues of electronic devices

Ambat, Rajan ; Jellesen, Morten Stendahl ; Verdingovas, Vadimas ; Piotrowska, Kamila ; Conseil, Helene
part of: Proceedings of EuroCorr 2014, 2014
Presented at: European Corrosion Congress

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014

 

Power Cycling and Thermal Stresses Analysis for High Efficiency DC/DC Converter (IFBBC) in Repetitive Avalanche Conditions

Pittini, Riccardo ; Zhang, Zhe ; Staliulionis, Zygimantas ; Andersen, Michael A. E.
part of: Proceedings of 18th International Conference ELECTRONICS 2014 , pages: 33-38, 2014
Presented at: 18th International Conference ELECTRONICS 2014

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014     |    DOI: https://doi.org/10.5755/e01.9786090210819

 

Thermal Modeling and Design of On-board DC-DC Power Converter using Finite Element Method

Staliulionis, Zygimantas ; Zhang, Zhe ; Pittini, Riccardo ; Andersen, Michael A. E. ; Noreika, A. ; Tarvydas, P.
in: Elektronika ir Elektrotechnika

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2014     |    DOI: https://doi.org/10.5755/j01.eee

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Thermal Modelling and Design of On-board DC-DC Power Converter using Finite Element Method

Staliulionis, Z. ; Zhang, Z. ; Pittini, R. ; Andersen, M. A. E. ; Noreika, A. ; Tarvydas, P.
in: Elektronika ir Elektrotechnika, vol: 20, issue: 7, pages: 38-44

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2014     |    DOI: https://doi.org/10.5755/j01.eee.20.7.8022

2013
 

Analysis of mode-hopping effect in Fabry–Pérot multiple-quantum well laser diodes via low frequency noise investigation

Pralgauskaitė, Sandra ; Palenskis, Vilius ; Matukas, Jonas ; Šaulys, Bronius ; Kornijčuk, Vladimir ; Verdingovas, Vadimas
in: Solid-State Electronics, vol: 79, pages: 104-110

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2013     |    DOI: https://doi.org/10.1016/j.sse.2012.07.021

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Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics

Conseil, Helene ; Jellesen, Morten Stendahl ; Verdingovas, Vadimas ; Ambat, Rajan
part of: EUROCORR 2013 - European Corrosion Congress, 2013
Presented at: European Corrosion Congress

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2013

 

Deposition of matrix-free fullerene films with improved morphology by matrix-assisted pulsed laser evaporation (MAPLE)

Canulescu, Stela ; Schou, Jørgen ; Fæster, Søren ; Hansen, Karin Vels ; Conseil, Helene
in: Chemical Physics Letters, vol: 588, pages: 119-123

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2013     |    DOI: https://doi.org/10.1016/j.cplett.2013.09.047

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Impact of hygroscopicity and composition of solder flux residue on the reliability of PCBA under corrosive conditions

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Rizzo, Riccardo ; Conseil, Helene ; Ambat, Rajan
part of: Proceedings of EUROCORR 2013, 2013
Presented at: European Corrosion Congress

Type: Conference abstract in proceedings (Peer reviewed)

Status: Published     |    Year: 2013

 

Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Corrosion Engineering Science and Technology, vol: 48, issue: 6, pages: 426-435

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2013     |    DOI: https://doi.org/10.1179/1743278213Y.0000000078

 

Synthesis of Polycyclic Aminocyclobutane Systems by the Rearrangement of N-(ortho-Vinylphenyl) 2-Azabicyclo[3.1.0]hexane Derivatives

Wasilewska, Agnieszka ; Wozniak, Bartosz A. ; Doridot, Gabriel ; Piotrowska, Kamila ; Witkowska, Natalia ; Retailleau, Pascal ; Six, Yvan
in: Chemistry - A European Journal, vol: 19, pages: 11759 – 11767

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2013     |    DOI: https://doi.org/10.1002/chem.201300871

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Thin films of C60 produced by matrix-assisted pulsed laser evaporation (MAPLE)

Canulescu, Stela ; Schou, Jørgen ; Fæster, Søren ; Hansen, Karin Vels ; Conseil, Helene ; Ambat, Rajan
Presented at: 2013 JSAP-MRS Joint Symposia

Type: Conference abstract for conference (Peer reviewed)

Status: Published     |    Year: 2013

2012
 

Allergic nickel dermatitis caused by playing the guitar: case report and assessment of nickel release from guitar strings.

Friis, Ulrik F. ; Menné, Torkil ; Jellesen, Morten Stendahl ; Møller, Per ; Verdingovas, Vadimas ; Jensen, Thomas R. ; Thyssen, Jacob Pontoppidan ; Johansen, Jeanne Duus
in: Contact Dermatitis, vol: 67, issue: 2, pages: 101-103

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2012

  PDF

Effect of ionic contamination on climatic reliability of printed circuit board assemblies

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress 2012, 2013
Presented at: EUROCORR 2012

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2012

2011
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Relation Between PCBA Cleanliness and Climatic Reliability

Jellesen, Morten Stendahl ; Westermann, Peter ; Verdingovas, Vadimas ; Holm, Pernille ; Ambat, Rajan
part of: European Corrosion Congress 2011, pages: 808-821, 2012
Presented at: EUROCORR 2011

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2011


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