Publications

The following list of publications is based on publications from Professor Rajan Ambat and Professor Jesper Hattel's researchers in the INSPE project. The list is automatically generated by the university database, and hence, it can also contains publications that are not related to the IN SPE project.

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ALL ARTICLE (54) DISSERTATION (5) BOOK (1) CONF (35) REPORT (0) MISC (0) PATENT (0) PEER REV (90)
2019
 

Electrochemical Impedance Spectroscopy (EIS) for Monitoring the Water Load on PCBAs Under Cycling Condensing Conditions to Predict Electrochemical Migration Under DC Loads

Lauser, Simone ; Richter, Theresia ; Verdingovas, Verdimas ; Ambat, Rajan
part of: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), pages: 515-521, 2019
Presented at: 69th Electronic Components and Technology Conference

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1109/ECTC.2019.00084

 

Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions

Piotrowska, Kamila ; Lagana, Simone ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2019, 2019
Presented at: 2019 Pan Pacific Microelectronics Symposium

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.23919/PanPacific.2019.8696890

2018
 

Corrosion Reliability of Lead-Free Solder Systems Used in Electronics

Li, Feng ; Verdingovas, Vadimas ; Dirscherl, Kai ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) , pages: 67-71, 2019
Presented at: 2018 IMAPS Nordic Conference on Microelectronics Packaging

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.23919/NORDPAC.2018.8423855

  PDF

Implementation of electrochemical impedance spectroscopy (EIS) for assessment of humidity induced failure mechanisms on PCBAs

Lauser, Simone ; Eckold, Pierre ; Richter, Theresia ; Verdingovas, Vadimas ; Ambat, Rajan
Presented at: EUROCOR 2018 - Applied science with contstant awareness

Type: Paper (Peer reviewed)

Status: Published     |    Year: 2018

 

Water film formation on the PCBA surface and failure occurrence in electronics

Piotrowska, Kamila ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) , pages: 72-76, 2018
Presented at: 2018 IMAPS Nordic Conference on Microelectronics Packaging

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.23919/NORDPAC.2018.8423854

2017
 

A numerical investigation of the effect of ambient conditions on natural convection cooling of electronics

Shojaee Nasirabadi, Parizad ; Hattel, Jesper Henri
part of: 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2017), pages: 1-4, 2017
Presented at: 23rd International Workshop on Thermal Investigations of ICs and Systems

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/THERMINIC.2017.8233845

 

Corrosion reliability of lead-free solder systems used in electronics

Li, Feng ; Verdingovas, Vadimas ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017 , 2017
Presented at: 40th International Spring Seminar on Electronics Technology

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/ISSE.2017.8000929

 

Corrosion Reliability of Lead-free Solder Systems Used in Electronics

Li, Feng ; Verdingovas, Vadimas ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress (EUROCORR 2017), 2017
Presented at: European Corrosion Congress (EUROCORR 2017)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017

 

Effect of interior geometry on local climate inside an electronic device enclosure

Joshy, Salil ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the 16th IEEE Intersociety Conference onThermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2017) , pages: 779-783, 2017
Presented at: 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/ITHERM.2017.7992565

 

Electrochemical migration of lead-free solder alloys in Na2SO4 environment

Medgyes, Balint ; Ádám, Sándor ; Tar, Lajos ; Verdingovas, Vadimas ; Ambat, Rajan ; Harsányi, Gábor
part of: Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017 , 2017
Presented at: 40th International Spring Seminar on Electronics Technology

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/ISSE.2017.8000932

  PDF

Reliability of electronics to humidity-related failures

Joshy, Salil ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Book of Abstracts Sustain 2017, 2017
Presented at: DTU Sustain 2017

Type: Conference abstract in proceedings (Peer reviewed)

Status: Published     |    Year: 2017

 

The influence of solder mask and hygroscopic flux residues on water layer formation on PCBA surface and corrosion reliability of electronics

Piotrowska, Kamila ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress (EUROCORR 2017), 2017
Presented at: European Corrosion Congress (EUROCORR 2017)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017

2016
 

Analysis of moisture transport between connected enclosures under a forced thermal gradient

Staliulionis, Zygimantas ; Joshy, Salil ; Ambat, Rajan ; Jabbaribehnam, Mirmasoud ; Mohanty, Sankhya ; Hattel, Jesper Henri
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 320-324, 2017
Presented at: 18th Electronics Packaging Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/EPTC.2016.7861497

  PDF

Estimation of Water Diffusion Coefficient into Polycarbonate at Different Temperatures Using Numerical Simulation

Shojaee Nasirabadi, Parizad ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
in: A I P Conference Proceedings Series, vol: 1738
Presented at: 13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)

Type: Conference article (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1063/1.4951801

  PDF

Experimental study of humidity distribution inside electronic enclosure and effect of internal heating

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress : EUROCORR 2015, 2016
Presented at: The European Corrosion Congress - EUROCORR 2015

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016

 

Improving intrinsic corrosion reliability of printed circuit board assembly

Ambat, Rajan ; Conseil, Helene
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 540-544, 2017
Presented at: 18th Electronics Packaging Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/EPTC.2016.7861538

 

Mathematical modelling of coupled heat and mass transport into an electronic enclosure

Staliulionis, Zygimantas ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
part of: Proceedings of the 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016 , pages: 323-326, 2016
Presented at: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/THERMINIC.2016.7749076

  PDF

Moisture ingress into electronics enclosures under isothermal conditions

Staliulionis, Zygimantas ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
in: A I P Conference Proceedings Series, vol: 1738
Presented at: 13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)

Type: Conference article (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1063/1.4951797

 

Numerical simulation of transient moisture and temperature distribution in polycarbonate and aluminum electronic enclosures

Shojaee Nasirabadi, Parizad ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
part of: Proceedings of the 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) , 2016
Presented at: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/EuroSimE.2016.7463382

  PDF

Numerical Simulation of Transient Moisture Transfer into an Electronic Enclosure

Shojaee Nasirabadi, Parizad ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
in: A I P Conference Proceedings Series, vol: 1738
Presented at: 13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)

Type: Conference article (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1063/1.4951794

 

Optimization of electronic enclosure design for thermal and moisture management using calibrated models of progressive complexity

Mohanty, Sankhya ; Staliulionis, Zygimantas ; Shojaee Nasirabadi, Parizad ; Ambat, Rajan ; Hattel, Jesper Henri
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 483-487, 2017
Presented at: 18th Electronics Packaging Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/EPTC.2016.7861525

 

Semi-empirical prediction of moisture build-up in an electronic enclosure using analysis of variance (ANOVA)

Shojaee Nasirabadi, Parizad ; Conseil, Helene ; Mohanty, Sankhya ; Jabbaribehnam, Mirmasoud ; Ambat, Rajan ; Hattel, Jesper Henri
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 785-790, 2017
Presented at: 18th Electronics Packaging Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: https://doi.org/10.1109/EPTC.2016.7861588

2015
  PDF

Contamination, potential bias and humidity effects on electrical performance and corrosion reliability of electronic devices

Piotrowska, Kamila ; Verdingovas, Vadimas ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress, 2015
Presented at: The European Corrosion Congress - EUROCORR 2015

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2015

 

Experimental study of humidity and temperature profile into electronic enclosure exposed to high humidity and thermal cycles

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the IMAPS Nordic Annual Conference 2015, pages: 111-117, 2016
Presented at: IMAPS Nordic Annual Conference 2015

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2015

 

Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

Joshy, Salil ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the 17th Electronics Packaging and Technology Conference (EPTC) , 2016
Presented at: 17th Electronics Packaging and Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/10.1109/EPTC.2015.7412281

2014
  PDF

Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of EuroCorr 2014, 2014
Presented at: European Corrosion Congress

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014

  PDF

Corrosion in electronics: Overview of failures and countermeasures

Jellesen, Morten Stendahl ; Verdingovas, Vadimas ; Conseil, Helene ; Piotrowska, Kamila ; Ambat, Rajan
part of: Proceedings of EuroCorr 2014, 2014
Presented at: European Corrosion Congress

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014

  PDF

Corrosion reliability of electronics: the influence of solder temperature on the decomposition of flux activators

Piotrowska, Kamila ; Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of EuroCorr 2014, 2014
Presented at: European Corrosion Congress

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014

 

Experimental study of water absorption of electronic components and internal local temperature and humidity into electronic enclosure

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the 16th Electronics Packaging Technology Conference (EPTC 2014) , pages: 355-359, 2015
Presented at: 16th Electronics Packaging Technology Conference

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014     |    DOI: https://doi.org/10.1109/EPTC.2014.7028356

  PDF

Perspectives on the climatic reliability issues of electronic devices

Ambat, Rajan ; Jellesen, Morten Stendahl ; Verdingovas, Vadimas ; Piotrowska, Kamila ; Conseil, Helene
part of: Proceedings of EuroCorr 2014, 2014
Presented at: European Corrosion Congress

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014

 

Power Cycling and Thermal Stresses Analysis for High Efficiency DC/DC Converter (IFBBC) in Repetitive Avalanche Conditions

Pittini, Riccardo ; Zhang, Zhe ; Staliulionis, Zygimantas ; Andersen, Michael A. E.
part of: Proceedings of 18th International Conference ELECTRONICS 2014 , pages: 33-38, 2014
Presented at: 18th International Conference ELECTRONICS 2014

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014     |    DOI: https://doi.org/10.5755/e01.9786090210819

2013
  PDF

Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics

Conseil, Helene ; Jellesen, Morten Stendahl ; Verdingovas, Vadimas ; Ambat, Rajan
part of: EUROCORR 2013 - European Corrosion Congress, 2013
Presented at: European Corrosion Congress

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2013

  PDF

Impact of hygroscopicity and composition of solder flux residue on the reliability of PCBA under corrosive conditions

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Rizzo, Riccardo ; Conseil, Helene ; Ambat, Rajan
part of: Proceedings of EUROCORR 2013, 2013
Presented at: European Corrosion Congress

Type: Conference abstract in proceedings (Peer reviewed)

Status: Published     |    Year: 2013

2012
  PDF

Effect of ionic contamination on climatic reliability of printed circuit board assemblies

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress 2012, 2013
Presented at: EUROCORR 2012

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2012

2011
  PDF

Relation Between PCBA Cleanliness and Climatic Reliability

Jellesen, Morten Stendahl ; Westermann, Peter ; Verdingovas, Vadimas ; Holm, Pernille ; Ambat, Rajan
part of: European Corrosion Congress 2011, pages: 808-821, 2012
Presented at: EUROCORR 2011

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2011


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