Publications

The following list of publications is based on publications from Professor Rajan Ambat and Professor Jesper Hattel's researchers in the INSPE project. The list is automatically generated by the university database, and hence, it can also contains publications that are not related to the IN SPE project.

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2015
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Contamination, potential bias and humidity effects on electrical performance and corrosion reliability of electronic devices

Piotrowska, Kamila ; Verdingovas, Vadimas ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress, 2015
Presented at:
The European Corrosion Congress - EUROCORR 2015

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2015

 

Effect of iodine on the corrosion of Au-Al wire bonds

Verdingovas, Vadimas ; Müller, Lutz ; Jellesen, Morten Stendahl ; Grumsen, Flemming Bjerg ; Ambat, Rajan
in: Corrosion Science, vol: 97, pages: 161-171

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/10.1016/j.corsci.2015.05.003

 

Effect of pulsed voltage on electrochemical migration of tin in electronics

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Materials Science: Materials in Electronics, vol: 26, issue: 10, pages: 7997-8007

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/10.1007/s10854-015-3454-9

 

Experimental study of humidity and temperature profile into electronic enclosure exposed to high humidity and thermal cycles

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the IMAPS Nordic Annual Conference 2015, pages: 111-117, 2016
Presented at:
IMAPS Nordic Annual Conference 2015

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2015

 

Relative effect of solder flux chemistry on the humidity related failures in electronics

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Soldering & Surface Mount Technology, vol: 27, issue: 4, pages: 146-156

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/dx.doi.org/10.1108/SSMT-11-2014-0022

 

Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

Joshy, Salil ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the 17th Electronics Packaging and Technology Conference (EPTC) , 2016
Presented at:
17th Electronics Packaging and Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/10.1109/EPTC.2015.7412281

 

Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Electronic Materials, vol: 44, issue: 4, pages: 1116-1127

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/10.1007/s11664-014-3609-0

 

Steam assisted oxide growth on aluminium alloys using oxidative chemistries: Part I Microstructural investigation

Din, Rameez Ud ; Piotrowska, Kamila ; Gudla, Visweswara Chakravarthy ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Applied Surface Science, vol: 355, pages: 820-831

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2015     |    DOI: https://doi.org/10.1016/j.apsusc.2015.07.182

2014
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Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of EuroCorr 2014, 2014
Presented at:
European Corrosion Congress

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014

 

Contamination profile on typical printed circuit board assemblies vs soldering process

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Soldering & Surface Mount Technology, vol: 26, issue: 4, pages: 194–202

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2014     |    DOI: https://doi.org/10.1108/SSMT-03-2014-0007