Publications

The following list of publications is based on publications from Professor Rajan Ambat and Professor Jesper Hattel's researchers in the INSPE project. The list is automatically generated by the university database, and hence, it can also contains publications that are not related to the IN SPE project.

Publikationer

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ALL ARTICLE (56) DISSERTATION (5) BOOK (1) CONF (35) REPORT (0) MISC (0) PATENT (0) PEER REV (92)

2016

Experimental study of humidity distribution inside electronic enclosure and effect of internal heating

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress : EUROCORR 2015, 2016
Presented at: The European Corrosion Congress - EUROCORR 2015

Type: Article in proceedings (Peer reviewed)

Status: Published | Year: 2016

Humidity Build-Up in a Typical Electronic Enclosure Exposed to Cycling Conditions and Effect on Corrosion Reliability

Conseil, Helene ; Gudla, Visweswara Chakravarthy ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: I E E E Transactions on Components, Packaging and Manufacturing Technology, vol: 6, issue: 9, pages: 1379-1388

Type: Journal article (Peer reviewed)

Status: Published | Year: 2016 | DOI: https://doi.org/10.1109/TCPMT.2016.2590779

Improving intrinsic corrosion reliability of printed circuit board assembly

Ambat, Rajan ; Conseil, Helene
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 540-544, 2017
Presented at: 18th Electronics Packaging Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published | Year: 2016 | DOI: https://doi.org/10.1109/EPTC.2016.7861538

Mathematical modelling of coupled heat and mass transport into an electronic enclosure

Staliulionis, Zygimantas ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
part of: Proceedings of the 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016 , pages: 323-326, 2016
Presented at: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016

Type: Article in proceedings (Peer reviewed)

Status: Published | Year: 2016 | DOI: https://doi.org/10.1109/THERMINIC.2016.7749076

Moisture ingress into electronics enclosures under isothermal conditions

Staliulionis, Zygimantas ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
in: A I P Conference Proceedings Series, vol: 1738
Presented at: 13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)

Type: Conference article (Peer reviewed)

Status: Published | Year: 2016 | DOI: https://doi.org/10.1063/1.4951797

Numerical simulation of transient moisture and temperature distribution in polycarbonate and aluminum electronic enclosures

Shojaee Nasirabadi, Parizad ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
part of: Proceedings of the 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) , 2016
Presented at: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Type: Article in proceedings (Peer reviewed)

Status: Published | Year: 2016 | DOI: https://doi.org/10.1109/EuroSimE.2016.7463382

Numerical Simulation of Transient Moisture Transfer into an Electronic Enclosure

Shojaee Nasirabadi, Parizad ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
in: A I P Conference Proceedings Series, vol: 1738
Presented at: 13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)

Type: Conference article (Peer reviewed)

Status: Published | Year: 2016 | DOI: https://doi.org/10.1063/1.4951794

Optimization of electronic enclosure design for thermal and moisture management using calibrated models of progressive complexity

Mohanty, Sankhya ; Staliulionis, Zygimantas ; Shojaee Nasirabadi, Parizad ; Ambat, Rajan ; Hattel, Jesper Henri
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 483-487, 2017
Presented at: 18th Electronics Packaging Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published | Year: 2016 | DOI: https://doi.org/10.1109/EPTC.2016.7861525

Semi-empirical prediction of moisture build-up in an electronic enclosure using analysis of variance (ANOVA)

Shojaee Nasirabadi, Parizad ; Conseil, Helene ; Mohanty, Sankhya ; Jabbaribehnam, Mirmasoud ; Ambat, Rajan ; Hattel, Jesper Henri
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 785-790, 2017
Presented at: 18th Electronics Packaging Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published | Year: 2016 | DOI: https://doi.org/10.1109/EPTC.2016.7861588

2015

Climatic Reliability of Electronics: Early Prediction and Control of Contamination and humidity effects

Verdingovas, Vadimas

Type: Ph.D. thesis

Status: Published | Year: 2015

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