Publications

The following list of publications is based on publications from Professor Rajan Ambat and Professor Jesper Hattel's researchers in the INSPE project. The list is automatically generated by the university database, and hence, it can also contains publications that are not related to the IN SPE project.

Publikationer

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ALL ARTICLE (56) DISSERTATION (5) BOOK (1) CONF (35) REPORT (0) MISC (0) PATENT (0) PEER REV (92)

2017

Numerical Modelling of Local Climate Inside Electronics Enclosures

Shojaee Nasirabadi, Parizad

Type: Ph.D. thesis

Status: Published | Year: 2017

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

D’Angelo, L. ; Verdingovas, V. ; Ferrero, L. ; Bolzacchini, E. ; Ambat, R.
in: IEEE Transactions on Device and Materials Reliability, vol: 17, issue: 4, pages: 746-757

Type: Journal article (Peer reviewed)

Status: Published | Year: 2017 | DOI: https://doi.org/10.1109/TDMR.2017.2771505

Parametric study of interior climate in electronic device enclosures and corrosion reliability

Conseil-Gudla, Helene

Type: Ph.D. thesis

Status: Published | Year: 2017

Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Electronic Materials, vol: 46, issue: 2, pages: 817–825

Type: Journal article (Peer reviewed)

Status: Published | Year: 2017 | DOI: https://doi.org/10.1007/s11664-016-4974-7

Reliability of electronics to humidity-related failures

Joshy, Salil ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Book of Abstracts Sustain 2017, 2017
Presented at: DTU Sustain 2017

Type: Conference abstract in proceedings (Peer reviewed)

Status: Published | Year: 2017

The influence of solder mask and hygroscopic flux residues on water layer formation on PCBA surface and corrosion reliability of electronics

Piotrowska, Kamila ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress (EUROCORR 2017), 2017
Presented at: European Corrosion Congress (EUROCORR 2017)

Type: Article in proceedings (Peer reviewed)

Status: Published | Year: 2017

Thermal decomposition of solder flux activators under simulated wave soldering conditions

Piotrowska, Kamila ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Soldering & Surface Mount Technology, vol: 29, issue: 3, pages: 133-143

Type: Journal article (Peer reviewed)

Status: Published | Year: 2017 | DOI: https://doi.org/10.1108/SSMT-01-2017-0003

2016

Analysis of moisture transport between connected enclosures under a forced thermal gradient

Staliulionis, Zygimantas ; Joshy, Salil ; Ambat, Rajan ; Jabbaribehnam, Mirmasoud ; Mohanty, Sankhya ; Hattel, Jesper Henri
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 320-324, 2017
Presented at: 18th Electronics Packaging Technology Conference (EPTC)

Type: Article in proceedings (Peer reviewed)

Status: Published | Year: 2016 | DOI: https://doi.org/10.1109/EPTC.2016.7861497

Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

Conseil, Helene ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Materials Science: Materials in Electronics, pages: 23-32

Type: Journal article (Peer reviewed)

Status: Published | Year: 2016 | DOI: https://doi.org/10.1007/s10854-015-3712-x

Estimation of Water Diffusion Coefficient into Polycarbonate at Different Temperatures Using Numerical Simulation

Shojaee Nasirabadi, Parizad ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri
in: A I P Conference Proceedings Series, vol: 1738
Presented at: 13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)

Type: Conference article (Peer reviewed)

Status: Published | Year: 2016 | DOI: https://doi.org/10.1063/1.4951801

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