Publications

The following list of publications is based on publications from Professor Rajan Ambat and Professor Jesper Hattel's researchers in the INSPE project. The list is automatically generated by the university database, and hence, it can also contains publications that are not related to the IN SPE project.

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ALL ARTICLE (54) DISSERTATION (5) BOOK (1) CONF (35) REPORT (0) MISC (0) PATENT (0) PEER REV (90)

2018

A 3D numerical study of humidity evolution and condensation risk on a printed circuit board (PCB) exposed to harsh ambient conditions

Shojaee Nasirabadi, Parizad ; Hattel, Jesper Henri
in: Microelectronics Reliability, vol: 83, pages: 39-49

Type: Journal article (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.1016/j.microrel.2018.02.008

Corrosion Reliability of Lead-Free Solder Systems Used in Electronics

Li, Feng ; Verdingovas, Vadimas ; Dirscherl, Kai ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) , pages: 67-71, 2019
Presented at: 2018 IMAPS Nordic Conference on Microelectronics Packaging

Type: Article in proceedings (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.23919/NORDPAC.2018.8423855

Effect of Solder Mask Surface Chemistry and Morphology on the Water Layer Formation Under Humid Conditions

Piotrowska, Kamila ; Din, Rameez Ud ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: I E E E Transactions on Components, Packaging and Manufacturing Technology, vol: 8, issue: 10, pages: 1756-1768

Type: Journal article (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.1109/TCPMT.2018.2792047

Experimental Study of Moisture Ingress in First and Second Levels of Electronic Housings

Conseil-Gudla, Helene ; Hamm, Gerald ; Mueller, Lutz ; Hain, Mathias ; Ambat, Rajan
in: I E E E Transactions on Components, Packaging and Manufacturing Technology, vol: 8, issue: 11, pages: 1928-1937

Type: Journal article (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.1109/TCPMT.2018.2799233

Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction

Conseil-Gudla, H. ; Staliulionis, Z. ; Mohanty, S. ; Jellesen, M. S. ; Hattel, J. H. ; Ambat, R.
in: Microelectronics Reliability, vol: 82, pages: 136-146

Type: Journal article (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.1016/j.microrel.2018.01.013

Humidity-related failures in electronics: effect of binary mixtures of weak organic acid activators

Piotrowska, Kamila ; Verdingovas, Vadimas ; Ambat, Rajan
in: Journal of Materials Science: Materials in Electronics, vol: 29, issue: 20, pages: 17834-17852

Type: Journal article (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.1007/s10854-018-9896-0

Implementation of electrochemical impedance spectroscopy (EIS) for assessment of humidity induced failure mechanisms on PCBAs

Lauser, Simone ; Eckold, Pierre ; Richter, Theresia ; Verdingovas, Vadimas ; Ambat, Rajan
Presented at: EUROCOR 2018 - Applied science with contstant awareness

Type: Paper (Peer reviewed)

Status: Published | Year: 2018

Introduction of axial chirality at a spiro carbon atom in the synthesis of pentaerythritol-imine macrocycles

Grajewski, J. ; Piotrowska, K. ; Zgorzelak, M. ; Janiak, A. ; Biniek-Antosiak, K. ; Rychlewska, U. ; Gawronski, J.
in: Organic & Biomolecular Chemistry, vol: 16, issue: 6, pages: 981-987

Type: Journal article (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.1039/C7OB02672B

Modeling of Moisture Transport into an Electronic Enclosure Using the Resistor-Capacitor Approach

Staliulionis, Z. ; Conseil-Gudla, H. ; Mohanty, S. ; Jabbari, M. ; Ambat, R. ; Hattel, J. H.
in: Journal of Electronic Packaging, vol: 140, issue: 3

Type: Journal article (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.1115/1.4039790

Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics

Piotrowska, Kamila ; Ud Din, Rameez ; Grumsen, Flemming Bjerg ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Electronic Materials, vol: 47, issue: 7, pages: 4190-4207

Type: Journal article (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.1007/s11664-018-6311-9

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