Publications

The following list of publications is based on publications from Professor Rajan Ambat and Professor Jesper Hattel's researchers in the INSPE project. The list is automatically generated by the university database, and hence, it can also contains publications that are not related to the IN SPE project.

Publikationer

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ALL ARTICLE (56) DISSERTATION (5) BOOK (1) CONF (35) REPORT (0) MISC (0) PATENT (0) PEER REV (92)

2019

Electrochemical Impedance Spectroscopy (EIS) for Monitoring the Water Load on PCBAs Under Cycling Condensing Conditions to Predict Electrochemical Migration Under DC Loads

Lauser, Simone ; Richter, Theresia ; Verdingovas, Verdimas ; Ambat, Rajan
part of: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), pages: 515-521, 2019
Presented at: 69th Electronic Components and Technology Conference

Type: Article in proceedings (Peer reviewed)

Status: Published | Year: 2019 | DOI: https://doi.org/10.1109/ECTC.2019.00084

Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions

Piotrowska, Kamila ; Lagana, Simone ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2019, 2019
Presented at: 2019 Pan Pacific Microelectronics Symposium

Type: Article in proceedings (Peer reviewed)

Status: Published | Year: 2019 | DOI: https://doi.org/10.23919/PanPacific.2019.8696890

Long term prediction of local climate inside an electronics enclosure

Shojaee Nasirabadi, Parizad ; Ghiaasiaan, S. Mostafa ; Hattel, Jesper Henri
in: International Journal of Heat and Mass Transfer, vol: 137, pages: 280-291

Type: Journal article (Peer reviewed)

Status: Published | Year: 2019 | DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2019.03.128

No-Clean Solder Flux Chemistry and Temperature Effects on Humidity-Related Reliability of Electronics

Piotrowska, Kamila ; Grzelak, Magdalena ; Ambat, Rajan
in: Journal of Electronic Materials, vol: 48, issue: 2, pages: 1207-1222

Type: Journal article (Peer reviewed)

Status: Published | Year: 2019 | DOI: https://doi.org/10.1007/s11664-018-06862-4

2018

A 3D numerical study of humidity evolution and condensation risk on a printed circuit board (PCB) exposed to harsh ambient conditions

Shojaee Nasirabadi, Parizad ; Hattel, Jesper Henri
in: Microelectronics Reliability, vol: 83, pages: 39-49

Type: Journal article (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.1016/j.microrel.2018.02.008

Corrosion Reliability of Lead-Free Solder Systems Used in Electronics

Li, Feng ; Verdingovas, Vadimas ; Dirscherl, Kai ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) , pages: 67-71, 2019
Presented at: 2018 IMAPS Nordic Conference on Microelectronics Packaging

Type: Article in proceedings (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.23919/NORDPAC.2018.8423855

Effect of Solder Mask Surface Chemistry and Morphology on the Water Layer Formation Under Humid Conditions

Piotrowska, Kamila ; Din, Rameez Ud ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: I E E E Transactions on Components, Packaging and Manufacturing Technology, vol: 8, issue: 10, pages: 1756-1768

Type: Journal article (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.1109/TCPMT.2018.2792047

Experimental Study of Moisture Ingress in First and Second Levels of Electronic Housings

Conseil-Gudla, Helene ; Hamm, Gerald ; Mueller, Lutz ; Hain, Mathias ; Ambat, Rajan
in: I E E E Transactions on Components, Packaging and Manufacturing Technology, vol: 8, issue: 11, pages: 1928-1937

Type: Journal article (Peer reviewed)

Status: Published | Year: 2018 | DOI: https://doi.org/10.1109/TCPMT.2018.2799233