Publications

The following list of publications is based on publications from Professor Rajan Ambat and Professor Jesper Hattel's researchers in the INSPE project. The list is automatically generated by the university database, and hence, it can also contains publications that are not related to the IN SPE project.

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ALL ARTICLE (54) DISSERTATION (5) BOOK (1) CONF (35) REPORT (0) MISC (0) PATENT (0) PEER REV (90)
2020
 

Humidity Robustness of Plasma-Coated PCBs

Khangholi, Aliakbar ; Li, Feng ; Piotrowska, Kamila ; Loulidi, Samir ; Ambat, Rajan ; Van Assche, Guy ; Hubin, Annick ; De Graeve, Iris
in: Journal of Electronic Materials, vol: 49, issue: 1, pages: 848-860

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2020     |    DOI: https://doi.org/10.1007/s11664-019-07714-5

 

Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys

Li, Feng ; Verdingovas, Vadimas ; Dirscherl, Kai ; Harsányi, Gábor ; Medgyes, Bálint ; Ambat, Rajan
in: Journal of Materials Science: Materials in Electronics, vol: 31, pages: 15308–15321

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2020     |    DOI: https://doi.org/10.1007/s10854-020-04095-y

  PDF

Parametric study of regional climates on electronics: Understanding local climate effects on corrosion failure mechanisms

Guo, Qinim ; Conseil-Gudla, Helene ; Ambat, Rajan
Presented at: EUROCORR 2020

Type: Conference abstract for conference (Peer reviewed)

Status: Published     |    Year: 2020

  PDF

Residue-Assisted Water Layer Build-Up under Transient Climatic Conditions and Failure Occurrences in Electronics

Piotrowska, Kamila ; Ambat, Rajan
in: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol: 10, issue: 10, pages: 1617-1635

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2020     |    DOI: https://doi.org/10.1109/TCPMT.2020.3005933

 

Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability

Piotrowska, Kamila ; Li, Feng ; Ambat, Rajan
in: Soldering & Surface Mount Technology, vol: 32, issue: 2, pages: 93-103

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2020     |    DOI: https://doi.org/10.1108/ssmt-05-2019-0020

2019
  PDF

Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations

Joshy, Salil ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Microelectronics Reliability, vol: 93, pages: 81-88

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1016/j.microrel.2018.12.010

 

Electrochemical Impedance Spectroscopy (EIS) for Monitoring the Water Load on PCBAs Under Cycling Condensing Conditions to Predict Electrochemical Migration Under DC Loads

Lauser, Simone ; Richter, Theresia ; Verdingovas, Verdimas ; Ambat, Rajan
part of: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), pages: 515-521, 2019
Presented at: 69th Electronic Components and Technology Conference

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1109/ECTC.2019.00084

 

Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions

Piotrowska, Kamila ; Lagana, Simone ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2019, 2019
Presented at: 2019 Pan Pacific Microelectronics Symposium

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.23919/PanPacific.2019.8696890

 

Long term prediction of local climate inside an electronics enclosure

Shojaee Nasirabadi, Parizad ; Ghiaasiaan, S. Mostafa ; Hattel, Jesper Henri
in: International Journal of Heat and Mass Transfer, vol: 137, pages: 280-291

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2019.03.128

 

No-Clean Solder Flux Chemistry and Temperature Effects on Humidity-Related Reliability of Electronics

Piotrowska, Kamila ; Grzelak, Magdalena ; Ambat, Rajan
in: Journal of Electronic Materials, vol: 48, issue: 2, pages: 1207-1222

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1007/s11664-018-06862-4


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