Publications

The following list of publications is based on publications from Professor Rajan Ambat and Professor Jesper Hattel's researchers in the INSPE project. The list is automatically generated by the university database, and hence, it can also contains publications that are not related to the IN SPE project.

Publikationer

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ALL ARTICLE (56) DISSERTATION (5) BOOK (1) CONF (35) REPORT (0) MISC (0) PATENT (0) PEER REV (92)

2021

Investigation on the Hygroscopicity of Deposits at the Cold-End of Biomass and Coal-Fired Plants

Pan, Peiyuan ; Piotrowska, Kamila ; Montgomery, Melanie ; Ambat, Rajan ; Jellesen, Morten Stendahl ; Chen, Heng
in: Energy and Fuels, vol: 35, issue: 9, pages: 8006–8022

Type: Journal article (Peer reviewed)

Status: Published | Year: 2021 | DOI: https://doi.org/10.1021/acs.energyfuels.0c04221

Reflow Residues on Printed Circuit Board Assemblies and Interaction with Humidity

Conseil-Gudla, Helene ; Li, Feng ; Ambat, Rajan
in: IEEE Transactions on Device and Materials Reliability, vol: 21, issue: 4, pages: 594-602

Type: Journal article (Peer reviewed)

Status: Published | Year: 2021 | DOI: https://doi.org/10.1109/TDMR.2021.3120941

Solder mask surface properties and related PCBA failure due to build-up of water layer

Lakkaraju, Anish Rao ; Conseil-Gudla, Helene ; Steiner, Frantisek ; Ambat, Rajan
Presented at: EUROCORR 2021

Type: Conference abstract for conference

Status: Published | Year: 2021

The detrimental effects of water on electronic devices

Baylakoğlu, İlknur ; Fortier, Aleksandra ; Kyeong, San ; Ambat, Rajan ; Gudla, Helene Conseil ; H. Azarian, Michael ; G. Pecht, Michael
in: e-Prime - Advances in Electrical Engineering, Electronics and Energy, vol: 1, issue: 1

Type: Journal article (Peer reviewed)

Status: Published | Year: 2021 | DOI: https://doi.org/10.1016/j.prime.2021.100016

2020

Humidity Robustness of Plasma-Coated PCBs

Khangholi, Aliakbar ; Li, Feng ; Piotrowska, Kamila ; Loulidi, Samir ; Ambat, Rajan ; Van Assche, Guy ; Hubin, Annick ; De Graeve, Iris
in: Journal of Electronic Materials, vol: 49, issue: 1, pages: 848-860

Type: Journal article (Peer reviewed)

Status: Published | Year: 2020 | DOI: https://doi.org/10.1007/s11664-019-07714-5

Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys

Li, Feng ; Verdingovas, Vadimas ; Dirscherl, Kai ; Harsányi, Gábor ; Medgyes, Bálint ; Ambat, Rajan
in: Journal of Materials Science: Materials in Electronics, vol: 31, pages: 15308–15321

Type: Journal article (Peer reviewed)

Status: Published | Year: 2020 | DOI: https://doi.org/10.1007/s10854-020-04095-y

Parametric study of regional climates on electronics: Understanding local climate effects on corrosion failure mechanisms

Guo, Qinim ; Conseil-Gudla, Helene ; Ambat, Rajan
Presented at: EUROCORR 2020

Type: Conference abstract for conference (Peer reviewed)

Status: Published | Year: 2020

Residue-Assisted Water Layer Build-Up under Transient Climatic Conditions and Failure Occurrences in Electronics

Piotrowska, Kamila ; Ambat, Rajan
in: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol: 10, issue: 10, pages: 1617-1635

Type: Journal article (Peer reviewed)

Status: Published | Year: 2020 | DOI: https://doi.org/10.1109/TCPMT.2020.3005933

Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability

Piotrowska, Kamila ; Li, Feng ; Ambat, Rajan
in: Soldering & Surface Mount Technology, vol: 32, issue: 2, pages: 93-103

Type: Journal article (Peer reviewed)

Status: Published | Year: 2020 | DOI: https://doi.org/10.1108/ssmt-05-2019-0020

2019

Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations

Joshy, Salil ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Microelectronics Reliability, vol: 93, pages: 81-88

Type: Journal article (Peer reviewed)

Status: Published | Year: 2019 | DOI: https://doi.org/10.1016/j.microrel.2018.12.010

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