Publications

The following list of publications is based on publications from Professor Rajan Ambat and Professor Jesper Hattel's researchers in the INSPE project. The list is automatically generated by the university database, and hence, it can also contains publications that are not related to the IN SPE project.

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ALL ARTICLE (54) DISSERTATION (5) BOOK (1) CONF (35) REPORT (0) MISC (0) PATENT (0) PEER REV (90)
2019
 

Electrochemical Impedance Spectroscopy (EIS) for Monitoring the Water Load on PCBAs Under Cycling Condensing Conditions to Predict Electrochemical Migration Under DC Loads

Lauser, Simone ; Richter, Theresia ; Verdingovas, Verdimas ; Ambat, Rajan
part of: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), pages: 515-521, 2019
Presented at: 69th Electronic Components and Technology Conference

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1109/ECTC.2019.00084

 

Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions

Piotrowska, Kamila ; Lagana, Simone ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2019, 2019
Presented at: 2019 Pan Pacific Microelectronics Symposium

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.23919/PanPacific.2019.8696890

2018
 

Corrosion Reliability of Lead-Free Solder Systems Used in Electronics

Li, Feng ; Verdingovas, Vadimas ; Dirscherl, Kai ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) , pages: 67-71, 2019
Presented at: 2018 IMAPS Nordic Conference on Microelectronics Packaging

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.23919/NORDPAC.2018.8423855

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Implementation of electrochemical impedance spectroscopy (EIS) for assessment of humidity induced failure mechanisms on PCBAs

Lauser, Simone ; Eckold, Pierre ; Richter, Theresia ; Verdingovas, Vadimas ; Ambat, Rajan
Presented at: EUROCOR 2018 - Applied science with contstant awareness

Type: Paper (Peer reviewed)

Status: Published     |    Year: 2018

 

Water film formation on the PCBA surface and failure occurrence in electronics

Piotrowska, Kamila ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) , pages: 72-76, 2018
Presented at: 2018 IMAPS Nordic Conference on Microelectronics Packaging

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.23919/NORDPAC.2018.8423854

2017
 

A numerical investigation of the effect of ambient conditions on natural convection cooling of electronics

Shojaee Nasirabadi, Parizad ; Hattel, Jesper Henri
part of: 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2017), pages: 1-4, 2017
Presented at: 23rd International Workshop on Thermal Investigations of ICs and Systems

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/THERMINIC.2017.8233845

 

Corrosion reliability of lead-free solder systems used in electronics

Li, Feng ; Verdingovas, Vadimas ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017 , 2017
Presented at: 40th International Spring Seminar on Electronics Technology

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/ISSE.2017.8000929

 

Corrosion Reliability of Lead-free Solder Systems Used in Electronics

Li, Feng ; Verdingovas, Vadimas ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress (EUROCORR 2017), 2017
Presented at: European Corrosion Congress (EUROCORR 2017)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017

 

Effect of interior geometry on local climate inside an electronic device enclosure

Joshy, Salil ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the 16th IEEE Intersociety Conference onThermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2017) , pages: 779-783, 2017
Presented at: 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/ITHERM.2017.7992565

 

Electrochemical migration of lead-free solder alloys in Na2SO4 environment

Medgyes, Balint ; Ádám, Sándor ; Tar, Lajos ; Verdingovas, Vadimas ; Ambat, Rajan ; Harsányi, Gábor
part of: Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017 , 2017
Presented at: 40th International Spring Seminar on Electronics Technology

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/ISSE.2017.8000932


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