Publications

The following list of publications is based on publications from Professor Rajan Ambat and Professor Jesper Hattel's researchers in the INSPE project. The list is automatically generated by the university database, and hence, it can also contains publications that are not related to the IN SPE project.

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2020
 

Humidity Robustness of Plasma-Coated PCBs

Khangholi, Aliakbar ; Li, Feng ; Piotrowska, Kamila ; Loulidi, Samir ; Ambat, Rajan ; Van Assche, Guy ; Hubin, Annick ; De Graeve, Iris
in: Journal of Electronic Materials, vol: 49, issue: 1, pages: 848-860

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2020     |    DOI: https://doi.org/10.1007/s11664-019-07714-5

2019
 

Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations

Joshy, Salil ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Microelectronics Reliability, vol: 93, pages: 81-88

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1016/j.microrel.2018.12.010

 

Electrochemical Impedance Spectroscopy (EIS) for Monitoring the Water Load on PCBAs Under Cycling Condensing Conditions to Predict Electrochemical Migration Under DC Loads

Lauser, Simone ; Richter, Theresia ; Verdingovas, Verdimas ; Ambat, Rajan
part of: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), pages: 515-21, 2019, IEEE
Presented at:
69th Electronic Components and Technology Conference (ECTC)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1109/ECTC.2019.00084

 

Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions

Piotrowska, Kamila ; Lagana, Simone ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2019, 2019, IEEE
Presented at:
2019 Pan Pacific Microelectronics Symposium (Pan Pacific)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.23919/PanPacific.2019.8696890

 

Impact of Process-Related Flux Contamination on the Electronics Reliability Issus Under Detrimental Climatic Conditions

Piotrowska, Kamila ; Lagana, Simone ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2019, 2019, IEEE
Presented at:
24th Annual Pan Pacific Microelectronics Symposium

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2019

 

Long term prediction of local climate inside an electronics enclosure

Shojaee Nasirabadi, Parizad ; Ghiaasiaan, S. Mostafa ; Hattel, Jesper Henri
in: International Journal of Heat and Mass Transfer, vol: 137, pages: 280-291

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2019.03.128

 

No-Clean Solder Flux Chemistry and Temperature Effects on Humidity-Related Reliability of Electronics

Piotrowska, Kamila ; Grzelak, Magdalena ; Ambat, Rajan
in: Journal of Electronic Materials, vol: 48, issue: 2, pages: 1207-1222

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1007/s11664-018-06862-4

 

Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability

Piotrowska, Kamila ; Li, Feng ; Ambat, Rajan
in: Soldering & Surface Mount Technology

Type: Journal article (Peer reviewed)

Status: Accepted/In press     |    Year: 2019     |    DOI: https://doi.org/10.1108/ssmt-05-2019-0020

2018
 

A 3D numerical study of humidity evolution and condensation risk on a printed circuit board (PCB) exposed to harsh ambient conditions

Shojaee Nasirabadi, Parizad ; Hattel, Jesper Henri
in: Microelectronics Reliability, vol: 83, pages: 39-49

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1016/j.microrel.2018.02.008

 

Corrosion Reliability of Lead-Free Solder Systems Used in Electronics

Li, Feng ; Verdingovas, Vadimas ; Dirscherl, Kai ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) , pages: 67-71, 2019, IEEE
Presented at:
2018 IMAPS Nordic Conference on Microelectronics Packaging (NORDPAC 2018)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.23919/NORDPAC.2018.8423855