Publications

The following list of publications is based on publications from Professor Rajan Ambat and Professor Jesper Hattel's researchers in the INSPE project. The list is automatically generated by the university database, and hence, it can also contains publications that are not related to the IN SPE project.

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2024
 

Study of interaction between Reflow solder flux and humidity in relation to failures in electronics

Lakkaraju, Anish Rao ; Conseil-Gudla, Helene ; Ambat, Rajan
in: IEEE Transactions on Components, Packaging and Manufacturing Technology

Type: Journal article (Peer reviewed)

Status: Accepted/In press     |    Year: 2024     |    DOI: https://doi.org/10.1109/TCPMT.2024.3369076

2022
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A climate classification for corrosion control in electronic system design

Spooner, Max ; Ambat, Rajan ; Gudla, Helene Conseil ; Kulahci, Murat
in: Machine Learning with Applications, vol: 9

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2022     |    DOI: https://doi.org/10.1016/j.mlwa.2022.100397

 

Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study

Xue, Peng ; Bahman, Amir Sajjad ; Iannuzzo, Francesco ; Gudla, Helene Conseil ; Lakkaraju, Anish Rao ; Ambat, Rajan
in: Microelectronics Reliability, vol: 139

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2022     |    DOI: https://doi.org/10.1016/j.microrel.2022.114796

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Synergetic effect of temperature and humidity on the leakage of KOH electrolyte and related reliability of zinc-air batteries

Rao, Jyothsna Murli ; Yadav, Abhijeet ; Conseil-Gudla, Helene ; Ambat, Rajan
in: Frontiers in Materials, vol: 9

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2022     |    DOI: https://doi.org/10.3389/fmats.2022.1000808

 

Transient risk of water layer formation on PCBAs in different climates: Climate data analysis and experimental study

Conseil-Gudla, Helene ; Spooner, Max ; Kulahci, Murat ; Ambat, Rajan
in: Microelectronics Reliability, vol: 136

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2022     |    DOI: https://doi.org/10.1016/j.microrel.2022.114655

2021
 

Alkanolamines as activators in no-clean flux systems: investigation of humidity robustness and solderability

Li, Feng ; Piotrowska, Kamila ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Materials Science: Materials in Electronics, vol: 32, pages: 4961–4981

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2021     |    DOI: https://doi.org/10.1007/s10854-020-05235-0

 

Humidity Control in Electronic Devices

Conseil-Gudla, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol: 11, issue: 2, pages: 324-332

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2021     |    DOI: https://doi.org/10.1109/TCPMT.2020.3045495

 

Investigation on the Hygroscopicity of Deposits at the Cold-End of Biomass and Coal-Fired Plants

Pan, Peiyuan ; Piotrowska, Kamila ; Montgomery, Melanie ; Ambat, Rajan ; Jellesen, Morten Stendahl ; Chen, Heng
in: Energy and Fuels, vol: 35, issue: 9, pages: 8006–8022

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2021     |    DOI: https://doi.org/10.1021/acs.energyfuels.0c04221

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Reflow Residues on Printed Circuit Board Assemblies and Interaction with Humidity

Conseil-Gudla, Helene ; Li, Feng ; Ambat, Rajan
in: IEEE Transactions on Device and Materials Reliability, vol: 21, issue: 4, pages: 594-602

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2021     |    DOI: https://doi.org/10.1109/TDMR.2021.3120941

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The detrimental effects of water on electronic devices

Baylakoğlu, İlknur ; Fortier, Aleksandra ; Kyeong, San ; Ambat, Rajan ; Gudla, Helene Conseil ; H. Azarian, Michael ; G. Pecht, Michael
in: e-Prime - Advances in Electrical Engineering, Electronics and Energy, vol: 1, issue: 1

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2021     |    DOI: https://doi.org/10.1016/j.prime.2021.100016